FARMINGTON, Conn., Jan. 30, 2013 /PRNewswire-iReach/ -- Smart packaging, a conceptual technology that was previously limited to the realm of science fiction, has become a real market with real implications. Innovation in modern merchandising has progressed well beyond static print: talking pizza boxes, winking rum bottles, and aerosols that emit electrically animated bug-chasing insecticide, medications that remind users when and how to take them.
The key enabling technology driving the smart packaging market is printed electronics, which will reduce costs for electronic smart packing by 99 percent to help this currently niche market grow to over $1.7 billion by 2023.
Flexible printed circuit boards (FPCBs) will also play a big role in the smart packaging market because FPCBs are found in all electronic products. The FPCB segment grew 15 percent between 2011 and 2012, passing $10.6 billion, and is further expected to grow by nearly 9 percent in 2013. With these growth prospects, opportunities abound for third-party manufacturers. Global Information (GII) highlights a trio of market research reports that examine the smart packaging industry, its related printed electronics and FPCB markets, and contract manufacturing opportunities in these markets.
Smart Packaging Comes To Market: Brand Enhancement with Electronics 2013-2023
The electronic smart packaging market is only warming up from smart medication that tracks and reminds users to reprogrammable phone decoration. As the global demand for electronic smart packaging surges to $1.7 billion and beyond over the next ten years, many leading brand owners are starting small by adopting new paper thin electronics on high volume packaging.
Electronic packaging (e-packaging) addresses the need for brands to reconnect with the customer or face oblivion from copying. That even applies to retailer own brands. It addresses the ageing population's consequent need for disposable medical testers and drug delivery devices. Electronic packaging addresses the fact that one third of us have difficulty reading ever smaller instructions.
This report includes profiles for the following suppliers and developers: ACREO, BASF, Blue Spark Technologies, CapXX, Cymbet, DSM Innovation, E-Ink, Enfucell, Excellatron, Fraunhofer Institute for Electronic Nano Systems (ENAS), Front Edge Technology, Holst Centre, Infinite Power Solutions, Infratab, Institute of Bioengineering and Nanotechnology (A*Star), Konarka, Kovio, Massachusetts Institute of Technology, Mitsubishi, Nano ePrint, NanoGram, National Renewable Energy Laboratory (NREL), NEC, New Uuniversity of Lisbon, Novalia, NTERA, Oak Ridge National Laboratory, Panasonic, Planar Energy, Plextronics, PolyIC, Power Paper, Prelonic Technologies, PST Sensor, Solarmer, Solicore, Soligie, Sony, T-Ink, and Waseda University.
An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/ix260725-smart-packaging-comes-market-brand-enhancement.html
Contract Manufacturing Opportunities in Printed Electronics
Printed electronics (PE) is now starting to show promise and commercialization. This report is a comprehensive market analysis of emerging printed electronics technologies and applications, and leverages our in-depth database of contract electronics manufacturing services (EMS) suppliers and markets built up over the past two decades. EMS suppliers are the best positioned to capitalize on the most promising PE opportunities, of which we have identified over 40 leading application areas. This report analyzes the highest potential products by end customer that stand to win out over traditional semiconductor and material technologies. This is because PE is creating a standalone market of its own as well as displacing some traditional semiconductor electronics. Certain market applications have clear economic and commercial advantages over the next five years.
An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/nvr260680-contract-manufacturing-opportunities-printed.html
Global and China Flexible Printed Circuit Board (FPCB) Industry Report, 2012
2012 was a bumper year for FPCB manufacturers, since FPCB is used in almost all popular electronic products, especially tablet PC and smart phone which have strongly promoted the FPCB market. The global FPCB market scale reached $10,680 million in 2012, an increase of 15.2% compared with 2011. FPCB achieved the strongest growth among all electronic parts and components in 2012, and will maintain the strong growth momentum in 2013. The global FPCB market scale is expected to reach $11,628 million in 2013, up 8.9% compared with 2012.
This report breaks down the FPCB industry and provides an overview of business models, regional FPC businesses, supplier relationships and FPCB manufacturer rankings. Leading FPCB manufacturers profiled in this report include: Fujikara, Nippon Mektron, Nitto Denko, Sony Chemical, M-Flex, Flexium, Carrer, Sunflex, Zhuhai Topsun, AKM, Jingchengda, Kinwong, Jinda PCB, Xiamen New Flex, Sumitomo Bakelite, Parlex, SI Flex, Sumitomo Electric Industries, Daeduck GDS, Interflex, Netron Soft-Tech, BHflex, Newflex, Flexcom, MFS, Ichia, and ZDT.
An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/rinc234090-global-china-flexible-printed-circuit-board-fpcb.html
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About Global Information Inc. Global Information (GII) (http://www.giiresearch.com) is an information service company partnering with over 300 research companies around the world. Global Information has been in the business of distributing technical and market research for more than 25 years. Expanded from its original headquarters in Japan, Global Information now has offices in Korea, Taiwan, Singapore, Europe and the United States.
SOURCE Global Information, Inc.